[Comp-neuro] TAEECE2014-CFP APU, Malaysia

The Second International Conference on Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE2014) ta2014 at sdiwc.net
Tue Dec 17 00:15:09 CET 2013


The Second International Conference on Technological Advances in
Electrical, Electronics and Computer Engineering (TAEECE2014)

Pacific University of Technology and Innovation (APU), Kuala Lumpur, Malaysia
                                                                                                                               March
18-20,
2014
                                                                                                     http://sdiwc.net/conferences/2014/taeece2014/
                                                                                  ****************************************************************************************************
The proposed conference on the above theme will be held at Asia Pacific
University of Technology and Innovation (APU), Kuala Lumpur, Malaysia,
>From March 18-20, 2014 which aims to enable researchers build connections
between different digital applications.
The conference welcomes papers on the following (but not limited to)
research topics:

**Electronics Engineering**
3D Semiconductor Device Technology
Adaptive Signal Processing
Advanced Electromagnetics
Artificial Intelligence
Component Technology of MEMS
Compound Semiconductor Physics and Devices
Computer Engineering
Device Electronics for I.C
Electronics System-Level Based Design
Electronics & Nano Electronics
Electronics-Medical Electronics
Epitaxy and Light-emitting Diodes
Fiber Optics and Fiber Devices
Giant Area Microelectronics
Intelligent Transportation Systems
Integrated Optics
Medicine and Biology Applications
Micro/Nano Systems and Networks
Mixed Signal Circuits	Mobile Computing
Mobile Robotics
Multimedia Services and Technologies
Networks Design, Protocols and Management
Optical Electronic Devices & Photonics
Radio-Frequency Integrated Circuits
Signal & Image Processing
VLSI Testing and Design for Testability
**Electrical Engineering**
Software Specification
Software Assurance
Analysis of Power Quality and System Stability
Assembly and Packaging
Analog Circuits and Digital Circuits
Antenna and Propagation
Battery Management System
Circuits and Electronics
Computer Relaying
Electric Energy Processing
Electromagnetic and Photonics
Electro-optical Phenomena of Semiconductors
Integrated Optics and Electro-optics Devices
Microwave Theory and Techniques
Microwave and millimeter circuit and Antenna
Modulation, Coding, and Channel Analysis
Power Electronics
Power IC
Remote Control and Techniques of GPS
Robotics and Atomization Engineering
Signal Integrity Design for High-Speed Digital Systems
Signal Processing
Simulation of Propagation
Smart Grid
Solar Power Generation
Techniques of Laser and Applications Of Electro-optics
Wind Power Generation
**Computer Engineering**
Algorithms
Artificial Intelligence
Automated Software Engineering
Bioinformatics and Scientific Computing
Computer-aided Design
Computer Animation
Computer Architecture
Computing Ethics
Computer Modeling
Computer Networks
Computer Security
Computer Simulation
Database and Data Mining
Data Compression
Data Encryption
Data Mining
Digital Signal and Image Processing
Digital System and Logic Design
Expert Systems
Image Processing
Information Systems
Internet and Web Applications
Mobile Computing
Network Security and Cryptography
Multimedia Applications
Multimedia Networking
Mobile Wireless Networks
Programming Languages
Wireless Communication
Wireless Sensor Network

Researchers are encouraged to submit their work electronically. All papers
will be fully refereed by a minimum of two specialized referees. Before
final acceptance, all referees comments must be considered.
**********************
Important Dates
**********************
Submission Deadline:             Feb. 18, 2014
Notification of Acceptance:      March 04, 2014 or 4 weeks from the
submission date
Camera Ready Submission:         March 08, 2014
Registration:                    March 08, 2014, however, it is
recommended to do it few days before
Conference Dates:	         March 18-20, 2014



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